製程能力

Process Capability
Technology Item Current Process Capability On-going Development
Layer Count 2~12 Layers 14~20 Layers
Min. Finished Hole Size 0.2 mm 0.15 mm
Max. Aspect Ratio 6 : 1 8 : 1
Min. Board Thickness (Final) 0.45 mm 0.30 mm
Max. Board Thickness (Final) 2.0 mm 3.0 mm
Min. Core Thickness 0.05 mm (Exclude Copper) 0.05 mm (Exclude Copper)
Min. Copper Thickness 0.5 oz 0.33 oz
Max. Copper Thickness 3 oz 5 oz
Min. Internal Layer Trace/Space 0.075 / 0.075 mm(3/3 mil) 0.063 / 0.063 mm (2.5/2.5 mil)
Min Outer Layer Trace/Space 0.075 / 0.075 mm(4/4 mil) 0.063 / 0.063 mm (2.5/2.5 mil)
Min SMD Size 0.2 mm (8 mil) 0.15 mm (6 mil)
Min. SMD Pitch 0.4 mm (16 mil) 0.35 mm (14 mil)
Hole Registration Tolerance 0.1 mm 0.075 mm
Image Registration Tolerance 0.037 mm 0.037 mm
Solder Mask Registration Tolerance 0.037 mm 0.037 mm
Min. Solder Dam 3 mil (0.075 mm) 2 mil (0.05 mm)
Impedance Control 10% 8%
Blind Hole and Bury Hole No Yes
PCB Warp and Twist 0.50% 0.50%
Material Capability
Technology Item Current Process Capability On-going Development
FR-4 Yes Yes
CEM-3 Yes Yes
Halogen Free FR-4 Yes Yes
Min. Board Thickness (Final) Yes Yes
CAF Resistant Laminate Yes Yes
Rogers Yes Yes
Solder Mask (Normal) Yes Yes
Solder Mask (Halogen Free) Yes Yes
Lead Free FR-4 Yes Yes
Final Coating Capability
Technology Item Current Process Capability On-going Development
OSP Yes Yes
Immersion Silver Yes Yes
Immersion Gold Yes Yes
Carbon Ink Yes Yes
Peelable Mask No Yes
HALF Yes Yes
Immersion Tin Yes Yes
ENIG Yes Yes
Resin Plug Yes Yes
VIP Yes Yes
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