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製程能力

泰鼎累積超過20年製程、材料及技術能力,提供多元專業的服務,期望滿足客戶所有需求。

Technology Item Current Process Capability On-going Development
Layer Count 2~20 Layers 20~30 Layers
Min. Finished Hole Size 0.15 mm 0.10 mm
Max. Aspect Ratio 10 : 1 16 : 1
Min. Board Thickness (Final) 0.45 mm 0.30 mm
Max. Board Thickness (Final) 3.0 mm 3.6 mm
Min. Core Thickness 0.05 mm (Exclude Copper) 0.05 mm (Exclude Copper)
Min. Copper Thickness 0.5 oz 0.33 oz
Max. Copper Thickness 3 oz 5 oz
Min. Internal Layer Trace/Space 0.065 /0.065 mm(2.5/2.5 mil) 0.05 / 0.05 mm (2.0/2.0 mil)
Min Outer Layer Trace/Space 0.065 / 0.065 mm(2.5/2.5 mil) 0.05 / 0.05 mm (2.0/2.0 mil)
Min SMD Size 0.175 mm (7 mil) 0.15 mm (6 mil)
Min. SMD Pitch 0.4 mm (16 mil) 0.3 mm (12 mil)
Hole Registration Tolerance 0.075 mm 0.05 mm
Image Registration Tolerance 0.037 mm 0.037 mm
Solder Mask Registration Tolerance 0.037 mm 0.037 mm
Min. Solder Dam 3 mil (0.075 mm) 2 mil (0.05 mm)
Impedance Control 10% 8%
Blind Hole and Bury Hole Yes Yes
PCB Warp and Twist 0.50% 0.50%
HDI Sequence build up process Yes Up to build up 3
Back drilling process Yes Yes

Material Capability

Technology Item Current Process Capability
FR-4 Yes
CEM-3 Yes
Halogen Free FR-4 Yes
Lead Free FR-4Yes
CAF Resistant Laminate Yes
Low Loss Materials Yes
Solder Mask (Normal) Yes
Solder Mask (Halogen Free) Yes

Final Surfaces

Technology Item Current Process Capability
OSP Yes
Immersion Silver Yes
ENIGYes
Immersion TinYes
Hot Air Leveling (Lead Free) Yes
Gold fingerYes
Carbon Ink Yes
Resin Plug Yes
VIPPO Yes
Cu-Via Filling Yes