| Layer Count |
2~20 Layers |
20~30 Layers |
| Min. Finished Hole Size |
0.15 mm |
0.10 mm |
| Max. Aspect Ratio |
10 : 1 |
16 : 1 |
| Min. Board Thickness (Final) |
0.45 mm |
0.30 mm |
| Max. Board Thickness (Final) |
3.0 mm |
3.6 mm |
| Min. Core Thickness |
0.05 mm (Exclude Copper) |
0.05 mm (Exclude Copper) |
| Min. Copper Thickness |
0.5 oz |
0.33 oz |
| Max. Copper Thickness |
3 oz |
5 oz |
| Min. Internal Layer Trace/Space |
0.065 /0.065 mm(2.5/2.5 mil) |
0.05 / 0.05 mm (2.0/2.0 mil) |
| Min Outer Layer Trace/Space |
0.065 / 0.065 mm(2.5/2.5 mil) |
0.05 / 0.05 mm (2.0/2.0 mil) |
| Min SMD Size |
0.175 mm (7 mil) |
0.15 mm (6 mil) |
| Min. SMD Pitch |
0.4 mm (16 mil) |
0.3 mm (12 mil) |
| Hole Registration Tolerance |
0.075 mm |
0.05 mm |
| Image Registration Tolerance |
0.037 mm |
0.037 mm |
| Solder Mask Registration Tolerance |
0.037 mm |
0.037 mm |
| Min. Solder Dam |
3 mil (0.075 mm) |
2 mil (0.05 mm) |
| Impedance Control |
10% |
8% |
| Blind Hole and Bury Hole |
Yes |
Yes |
| PCB Warp and Twist |
0.50% |
0.50% |
| HDI Sequence build up process |
Yes |
Up to build up 3 |
| Back drilling process |
Yes |
Yes |
